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SET 260
Term 6
4 credits

Capstone: Fab Operations and Troubleshooting

This capstone course provides students with a comprehensive, hands-on simulation of semiconductor fabrication operations, integrating knowledge from previous SET courses. Students will apply their understanding of process technology, equipment, and quality control to manage simulated production lines, identify and resolve common fab issues, and optimize workflow efficiency. Through case studies and project-based learning, learners develop critical thinking and problem-solving skills essential for maintaining uptime and yield in a manufacturing environment. Upon completion, students will be proficient in diagnosing operational faults, implementing corrective actions, and contributing effectively to a high-volume semiconductor production team.

Prerequisites

Course outline

Lectures, virtual labs, and graded assignments — completed in your browser.

01Capstone Project Kickoff and Fab Environment Reviewlecture
02Advanced Contamination Control and Cleanroom Best Practiceslecture
03Lithography Defects and Resolution Strategieslecture
04Etch Process Anomalies and Optimizationlecture
05Deposition Quality Control and Failure Analysislecture
06Dopant Uniformity and Implant Issue Resolutionlecture
07Metrology Tool Calibration and Measurement Accuracylecture
08Statistical Process Control in Wafer Fabricationlecture
09Preventive Maintenance and Equipment Uptimelecture
10MES Data Interpretation for Operational Efficiencylecture
11Industrial Safety and Emergency Response in the Fablecture
12Real-World Fab Challenges and Collaborative Solutionslecture
13Integrated Troubleshooting Exercise: A Comprehensive Fab Scenariolecture
14Capstone Showcase: Presenting Diagnostic and Repair Planslecture

Syllabus

Week 1: Introduction to Capstone Project and Fab Simulation Environment
Week 2: Review of Semiconductor Manufacturing Processes and Equipment
Week 3: Understanding Fab Workflow and Production Control Systems
Week 4: Common Issues in Front-End-of-Line (FEOL) Processes
Week 5: Troubleshooting Strategies for Lithography and Etch
Week 6: Defect Metrology and Yield Management Fundamentals
Week 7: Equipment Maintenance and Uptime Optimization
Week 8: Inter-process Variability and Its Impact on Yield
Week 9: Quality Control Methodologies in Semiconductor Fabs
Week 10: Advanced Diagnostics for Backend Processes
Week 11: Root Cause Analysis Techniques for Fab Excursions
Week 12: Continuous Improvement and Lean Principles in Fab Operations
Week 13: Emergency Response and Safety Protocols in the Cleanroom
Week 14: Final Project Presentation and Capstone Review